High-Speed Injection Molding Benefits

For plastic processors, shortening the work cycle as much as possible is one of the effective ways to increase efficiency. In order to meet the needs of product manufacturers, injection molding machine suppliers have launched a new design of ultra-high-speed molding solutions.

    Ultra-high speed electric injection molding machine

    At present, many companies invest heavily in laptops, LCD TVs, mobile phones, IT equipment, liquid crystal displays, LED chips and other precision electronic components.

    In view of this, Japan's Nissei Resin Industry Co., Ltd. will be exhibiting at the CHINAPLAS2010 exhibition in Shanghai in April. Specifically, it will focus on the high-precision and high-speed molding needs of the processing manufacturers. Electric injection molding machine.

    Ultra High-Speed High-Pressure Electric Injection Molding Machine NEX110-6EH is based on the "NEX Series" of Nissei Corporation's main model electric injection molding machine. It is developed mainly for thin wall products such as light guide plates, memory cards and narrow-pitch connectors. The clamping force is 1080kN (110 tons). The machine will demonstrate the molding of a 3-inch thin light guide plate (2 cavity).

    It is equipped with an ultra-high-speed injection mechanism, and its speed can be up to 2 times the NEX standard machine speed, that is, 1000mm/s, and the injection speed can reach 3.5 times the high response, and the injection pressure can reach 295MPa (3000kgf/cm2). In addition, due to the optimization of the plasticizing device, the high stability of the plasticizing and mixing is achieved. The mold clamping mechanism is based on the “straight-pressure type crank arm” that is recognized by the NEX standard machine as being excellent in quality and capable of achieving high rigidity, and further enhances the rigidity of the mold plate.

    The electric vertical injection molding machine TH40E5VE is a modification of the TH-E series vertical motor, with a clamping force of 392 kN (40 tons), which also enables high-speed injection and high response. The device is most suitable for the hoop insert molding of fine electronic components such as LED chips and micro-connectors. At the booth, the device will use a self-winding, in-mold hoop feeding device to perform live performance of the connector (16-cavity mold).

    This equipment is an injection molding machine that combines a single-action mode-locking mechanism and a center-injection (relative molding machine is vertical injection) mechanism. The single-action mode causes the upper mold of the mold to move up and down. Therefore, it is particularly suitable for hoop molding such as continuously forming wire terminals, and can flexibly correspond to molding necessary for three-dimensional bending processing of wire terminals as pretreatments, or post-processing of products.

    The characteristics of this vertical injection molding machine include: NEX series model injection mechanism to achieve high-speed injection speed; Through structural analysis, using high deformation of the deformation, minimal rigid template design; suitable for a variety of insert molding Compact design for flexible factory layout.